IMOS · ChipMOS TECHNOLOGIES INC.
$55.60
-0.69% last session
End-of-day data · close of 2026-09-11
Market cap
$2B
Enterprise value
$5B
Trailing P/E
28.3
Forward P/E
55.4
Dividend yield
1.0%
Beta
1.47
Avg volume
0M
Employees
—
Daily Change %
-0.69%
5 Days Change
1.35%
10 Days Change
6.86%
30 Days Change
-1.50%
60 Days Change
-22.96%
Month to Day Change
1.96%
Year to Day Change
99.65%
Analyst Outlook
Analyst estimates change daily — follow the shifts on the Estimate Trends page.
Technical Analysis
Signal Summary as of 2026-09-11
- RSI (14): RSI is 48 — neutral momentum, neither overbought nor oversold.
- Price vs 50-day MA: Trading 4.7% below the 50-day MA ($58.34).
- Price vs 200-day MA: Trading 20.6% above the 200-day MA ($46.12).
- MA cross: The 50-day MA sits above the 200-day MA (golden-cross regime) — the longer-term trend points up.
- MACD (12,26,9): MACD histogram is positive (+0.19) — short-term momentum is improving.
- 52-week range: Price sits between the 52-week low ($17.49) and high ($75.79).
IMOS Price Chart
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Fundamentals
About ChipMOS TECHNOLOGIES INC.
ChipMOS TECHNOLOGIES INC. engages in the research and development, manufacture, and sale of integrated circuits, and related assembly and testing services in Taiwan, Japan, the People's Republic of China, and internationally. It operates through five segments: Testing; Assembly; Display Panel Driver Semiconductor Assembly and Testing; Bumping; and Others. The company offers leadframe-based packages, such as the small outline package, thin small outline package, and quad flat package; and substrate-based packages, including FBGA, VFBGA, stacked chip-scale package, TFBGA, LGA, COG, and COF; and testing solutions comprising professional wafer and final testing, tester/tooling correlation, test program verification, engineering lot and pilot lot run arrangement, engineering support, device failure mode analysis, and automation system for simple digital logic, complex ASIC, high speed digital, memory, and mixed signal and display driver IC devices. It also provides bumping services; intellectual property management and enabling technologies; and turnkey services, such as wafer bumping/RDL, wafer sort, assembly, final test, and drop shipment to display driver IC, memory IC, and logic mixed-signal IC. The company serves fabless companies, integrated device manufacturers, and foundries. ChipMOS TECHNOLOGIES INC. was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.
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Data is sourced from end-of-day snapshots and refreshed daily before the US market open — nothing on this page is real-time. Figures can contain vendor errors. This page is for information only and is not investment advice.